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Ayo. I wanna replace the Thermal Material between the die and the IHS of my 8600G. As someone who has no experience with doing that i'm wondering what Solution to use.

 

My 3 Ideas were PTM, a Kryosheet or LM. I'm aware of the precautions when going for LM or a Kryosheet. I just wonder if theres some "ideal" choice in terms of performance and lognevity balance.

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3 minutes ago, Blindmech said:

Ayo. I wanna replace the Thermal Material between the die and the IHS of my 8600G. As someone who has no experience with doing that i'm wondering what Solution to use.

 

My 3 Ideas were PTM, a Kryosheet or LM. I'm aware of the precautions when going for LM or a Kryosheet. I just wonder if theres some "ideal" choice in terms of performance and lognevity balance.

Why?

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5 minutes ago, Blindmech said:

I wanna replace the Thermal Material between the die and the IHS of my 8600G...

image.jpeg.6685d5844f080a7da7ebef8228692e25.jpeg

I might be experienced, but I'm human and I do make mistakes. Trust but Verify! I edit my messages after sending them alot, please refresh before posting your reply. Please try to be clear and specific, you'll get a better answer. Please remember to mark solutions once you have the information you need. Expand this signature for common PC building advice, a short bio and a list of my components.

 

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Its a Tiny PC build. I've finished with the case mods in terms of temperature and wanted to squeeze out more out of this lil guy. And from what i've seen replacing the thermal Paste amd used for these seems to be quite effective to gain better temps. Especially since these tend to run quite hot.

 

Also: For learning purposes i guess. I enjoy tinkering and it was the next step in getting more performance for this cpu.

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10 minutes ago, Blindmech said:

Ayo. I wanna replace the Thermal Material between the die and the IHS of my 8600G. As someone who has no experience with doing that i'm wondering what Solution to use.

 

My 3 Ideas were PTM, a Kryosheet or LM. I'm aware of the precautions when going for LM or a Kryosheet. I just wonder if theres some "ideal" choice in terms of performance and lognevity balance.

Do it if you need, but the cheapest available paste would be ok, the 8600G don't need max paste performance, which is anyway max -3C...

AMD R9  7950X3D CPU/ Asus ROG STRIX X670E-E board/ 2x32GB G-Skill Trident Z Neo 6000CL30 RAM ASUS TUF Gaming AMD Radeon RX 7900 XTX OC Edition GPU/ Phanteks P600S case /  Arctic Liquid Freezer III 360 ARGB cooler/  2TB WD SN850 NVme + 2TB Crucial T500  NVme  + 4TB Toshiba X300 HDD / Corsair RM850x PSU/ Alienware AW3420DW 34" 120Hz 3440x1440p monitor / ASUS ROG AZOTH keyboard/ Logitech G PRO X Superlight mouse / Audeze Maxwell headphones

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1 minute ago, Blindmech said:

Its a Tiny PC build. I've finished with the case mods in terms of temperature and wanted to squeeze out more out of this lil guy. And from what i've seen replacing the thermal Paste amd used for these seems to be quite effective to gain better temps. Especially since these tend to run quite hot.

So by squeezing out more you mean overclocking or?

It is true that AM5 run warm but the CPU doesn't actually care if its at 56c or 93c, the performance will be identical.

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11 minutes ago, PDifolco said:

Do it if you need, but the cheapest available paste would be ok, the 8600G don't need max paste performance, which is anyway max -3C...

Tbf. No one of this has to be done. I really just wanna do it. 

 

11 minutes ago, Hinjima said:

So by squeezing out more you mean overclocking or?

It is true that AM5 run warm but the CPU doesn't actually care if its at 56c or 93c, the performance will be identical.

Yea. But I don't want my fan to go haywire 24/7 either. It's mainly to see where it can go. But yes. It is for over clocking purposes as well. Der 8auer lowered his temps by 10 to 20 degrees swapping to kryosheet/LM respectively on a 8700g. But I wanted to maybe get some more input from others who might've done something similar. Not necessarily on the same CPU as me but in general

 

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9 minutes ago, Blindmech said:

Tbf. No one of this has to be done. I really just wanna do it. 

 

Yea. But I don't want my fan to go haywire 24/7 either. It's mainly to see where it can go. But yes. It is for over clocking purposes as well. Der 8auer lowered his temps by 10 to 20 degrees swapping to kryosheet/LM respectively on a 8700g. But I wanted to maybe get some more input from others who might've done something similar. Not necessarily on the same CPU as me but in general

 

Adjust the fan curve 😄

Its a low powered CPU.

 

I run a overclocked 9800X3D ( up from 5.2 to 5.6Ghz ) with a air cooler set at only 30% constant fan speed.  I dont really care too much if the temperature go to 88c for exmaple during heavy gaming because that is still acceptable temperature and my system is quiet.

 

If its for tinkering and curiosity reasons, go for it.

Remember that most AM5 CPU's are soldered so most people have not delidded one.

And the few that run a Ryzen 8000 APU most likely dont know what delidding is.

I know that the Ryzen 8000 APU's are not soldered**

 

So finding someone more people who have done it is going to be quite the challenge 😄

 

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If you're just changing the TIM between the chip and IHS, liquid metal would be your best option.

Do keep in mind that at times the thickness of the IHS glue has to be counted for with liquid metal, since liquid metal is soo thin. But this also depends on the CPU.

It is still good to practice a bit with liquid metal, nail down the process, they will be extremely helpful on a laptop or phone. If you get really good at it, one small tube will last many many devices.

 

But imho

no point in keeping the IHS if you are already going to take it off, just run it delided.

Do keep in mind that it will be harder to get a even mount on a bare die. I use normal thermal compound first, then take it off to see if there is a side too high or too low. Then install it again with liquid metal. 

 

Performance wise liquid metal is better than PTM. Kryosheet is for constantly taking it on and off with extremely ease, it is a GAWD fking awful choice for daily use. 

 

I have a retro Win7 machine that I use quite often, it's bare die liquid metal all the way

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delidding will be very easy as it isnt soldered but yeah liquid metal 100% as kryosheet and ptm are more suited to gpus that dont benifit that much from lm anyways

 

you are doing this for performance not to be nuked by the damn tim again and cpus benifit alot from lm when delidded

 

ideally youd want to go direct die due to the asinine design of the am5 ihs nuking heat transfer but given you arent pushing it too hard youll probably be fine, just that anything above a phantom spirit is effectively useless due to the ihs heat transfer bottleneck

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9 hours ago, Blindmech said:

Tbf. No one of this has to be done. I really just wanna do it. 

 

Yea. But I don't want my fan to go haywire 24/7 either. It's mainly to see where it can go. But yes. It is for over clocking purposes as well. Der 8auer lowered his temps by 10 to 20 degrees swapping to kryosheet/LM respectively on a 8700g. But I wanted to maybe get some more input from others who might've done something similar. Not necessarily on the same CPU as me but in general

 

I'm pretty sure DerBauer didn't gain 10-20C by just changing the paste, he usually do direct die as well

I've used several pastes, Kryosheet, PTM7950, and temps impacts always were a few C apart only

LM is a good option only for direct die cooling,  on a 8600G that seems pretty overkill and I suspect not really useful, cost of block and loop will be better spent by just buying a faster CPU !

AMD R9  7950X3D CPU/ Asus ROG STRIX X670E-E board/ 2x32GB G-Skill Trident Z Neo 6000CL30 RAM ASUS TUF Gaming AMD Radeon RX 7900 XTX OC Edition GPU/ Phanteks P600S case /  Arctic Liquid Freezer III 360 ARGB cooler/  2TB WD SN850 NVme + 2TB Crucial T500  NVme  + 4TB Toshiba X300 HDD / Corsair RM850x PSU/ Alienware AW3420DW 34" 120Hz 3440x1440p monitor / ASUS ROG AZOTH keyboard/ Logitech G PRO X Superlight mouse / Audeze Maxwell headphones

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1 hour ago, PDifolco said:

I'm pretty sure DerBauer didn't gain 10-20C by just changing the paste, he usually do direct die as well

I've used several pastes, Kryosheet, PTM7950, and temps impacts always were a few C apart only

LM is a good option only for direct die cooling,  on a 8600G that seems pretty overkill and I suspect not really useful, cost of block and loop will be better spent by just buying a faster CPU !

This is the video im referring to. I know he's using an 8700g but i doubt they use a better paste on the 8600g. And he didnt even properly remount the IHS. I doubt that a proper remount would drastically improve the result but maybe a bit.
image.thumb.png.b9992b2b2288944b0a5a941971f1fd7a.png

 

Here's just the chart so you dont have to go through the whole video.

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