How high can you raise the temp of a newer gen Intel or Amd cpu without damaging it (provided that there is no electrical current through the cpu)?

[cleric_warlock]

This is a question specifically related to delidding as most lid glues and die solder soften in the 200 C range.

[SpookyCitrus]

If you use a proper delidding tool, the heat and softening the glue isn't an issue. You don't have to get it nearly hot enough to be a problem.

[Zando_]

That's probably a number only Intel or AMD know. The practical answer is "hot enough to soften the solder", because folks delid these successfully without killing them, so they can withstand at least that much heat. 

[cleric_warlock]

8 hours ago, Zando_ said:

That's probably a number only Intel or AMD know. The practical answer is "hot enough to soften the solder", because folks delid these successfully without killing them, so they can withstand at least that much heat. 

I found in the link below a more generalized description of die and substrate joining for semiconductors on SK hynix's website that describes that the epoxy joining the die and substrate of a semiconductor under construction is kept at between 150 C to 250 C. It seems likely that 250 C of heat is probably towards the upper limit of fine for a CPU with no electricity in its circuits given that it can obviously survive the die-substrate joining process. I'm also fairly sure that intel's CPUs use an indium alloy for solder which means a low melting point probably less than ~200 C. What do you guys think?

 

Link: https://news.skhynix.com/die-bonding-process-for-placing-a-chip-on-a-package-substrate/

[TheDankKoosh]

Solder is going to be softer at anything beyond normal operating temps, at least 100-120c is around the temp you'd want for the solder to be soft enough for mechanical pressure from the delidding tool to do its work, at least in my experience. I would start off with a pre-heat and then throw it in the tool, crank some and blast with a heatgun for a few seconds, repeat as needed until you feel pressure break off and see a notable shift in the IHS, keep cranking slow and steady during the process, chipping away at the SMDs on the substrate will likely cause issues so you want to take a lot of caution when performing this.