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G.Skill same sticks with different names?

Rarok
By Rarok
in CPUs, Motherboards, and Memory
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Go to solution Solved by Princess Luna,

The difference is on the actual DRAM modules used inside them.

3 minutes ago, Rarok said:

F4-3600C18D-16GTZR

This one uses Samsung B-Die

6 minutes ago, Rarok said:

GTZRX

This also uses Samsung B-Die but it was AMD Ready validated.

6 minutes ago, Rarok said:

F4-3600C18D-16GTZN

This one changes to SK Hynix A-Die.

Posted

I don't undertand the differences between some RAM sticks in G.Skill


Trindent Z RGB, Trident Z RGB (for AMD) and Trident Z Neo

F4-3600C18D-16GTZR

F4-3600C18D-16GTZRX
F4-3600C18D-16GTZN

 

Same voltage, same timings, same size, but of course the prices in shops are not the same (very little differences)

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Posted

The colour is the difference.

Quote me so I can reply back :) 

MY PC-> PSU: EVGA SuperNOVA T2 1000W 80 Plus Titanium MOTHERBOARD: ASUS X370 Crosshair VI Hero CPU: RYZEN 7 3700X RAM: G.Skill 32GB (4X8GB) DDR4 3200MHz C14 GPU: EVGA GTX 1080Ti FTW3 HYBRID STORAGE: Samsung 970 EVO 500GB NVMe SSD; 2TB WD Caviar Blue; Crucial MX500 500GB SSD CUSTOM LOOP: EK-Velocity Nickel + Plexi CPU block, EK-FC1080 GTX Ti Acetal + Nickel GPU Block w/ EK-FC1080 GTX Ti Backplate, EK-XRES 140 Revo D5 PWM, EK-CoolStream PE 240 w/ 2x Noctua NF-F12 Chromax fans, EK-ACF Fitting 10/13mm Nickel, Mayhems UV White tubing 13/10mm, 3x Noctua NF-S12A Chromax case fans

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Posted

F4-3600C18D-16GTZRX - Trident Z RGB (For AMD)

F4-3600C18D-16GTZN - Trident Z Neo

 

Specs are identical, the RX says it's tested for AMD platform compatibility, while the N says full compatibility on the latest AMD Ryzen 3000 series processors on AMD X570 chipset motherboards. So I suppose the RX hasn't been specifically tested for Zen 2 (but probably still works), while the N is slightly newer.

Remember to either quote or @mention others, so they are notified of your reply

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The Neo and non-Neo look different, the AMD and non-AMD set will basically be the same

AMD memory was more important at launch, when it wasn't supported as well.

"We're all in this together, might as well be friends" Tom, Toonami.

 

mini eLiXiVy: my open source 65% mechanical PCB, a build log, PCB anatomy and discussing open source licenses: https://linustechtips.com/topic/1366493-elixivy-a-65-mechanical-keyboard-build-log-pcb-anatomy-and-how-i-open-sourced-this-project/

 

mini_cardboard: a 4% keyboard build log and how keyboards work: https://linustechtips.com/topic/1328547-mini_cardboard-a-4-keyboard-build-log-and-how-keyboards-work/

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Posted
  • Solution

The difference is on the actual DRAM modules used inside them.

3 minutes ago, Rarok said:

F4-3600C18D-16GTZR

This one uses Samsung B-Die

6 minutes ago, Rarok said:

GTZRX

This also uses Samsung B-Die but it was AMD Ready validated.

6 minutes ago, Rarok said:

F4-3600C18D-16GTZN

This one changes to SK Hynix A-Die.

Personal Desktop":

CPU: Intel Core i7 10700K @5ghz |~| Cooling: bq! Dark Rock Pro 4 |~| MOBO: Gigabyte Z490UD ATX|~| RAM: 16gb DDR4 3333mhzCL16 G.Skill Trident Z |~| GPU: RX 6900XT Sapphire Nitro+ |~| PSU: Corsair TX650M 80Plus Gold |~| Boot:  SSD WD Green M.2 2280 240GB |~| Storage: 1x3TB HDD 7200rpm Seagate Barracuda + SanDisk Ultra 3D 1TB |~| Case: Fractal Design Meshify C Mini |~| Display: Toshiba UL7A 4K/60hz |~| OS: Windows 10 Pro.

Luna, the temporary Desktop:

CPU: AMD R9 7950XT  |~| Cooling: bq! Dark Rock 4 Pro |~| MOBO: Gigabyte Aorus Master |~| RAM: 32G Kingston HyperX |~| GPU: AMD Radeon RX 7900XTX (Reference) |~| PSU: Corsair HX1000 80+ Platinum |~| Windows Boot Drive: 2x 512GB (1TB total) Plextor SATA SSD (RAID0 volume) |~| Linux Boot Drive: 500GB Kingston A2000 |~| Storage: 4TB WD Black HDD |~| Case: Cooler Master Silencio S600 |~| Display 1 (leftmost): Eizo (unknown model) 1920x1080 IPS @ 60Hz|~| Display 2 (center): BenQ ZOWIE XL2540 1920x1080 TN @ 240Hz |~| Display 3 (rightmost): Wacom Cintiq Pro 24 3840x2160 IPS @ 60Hz 10-bit |~| OS: Windows 10 Pro (games / art) + Linux (distro: NixOS; programming and daily driver)
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Posted
  • Author
38 minutes ago, Princess Luna said:

The difference is on the actual DRAM modules used inside them.

This one uses Samsung B-Die

This also uses Samsung B-Die but it was AMD Ready validated.

This one changes to SK Hynix A-Die.

The validation is something that I don't understand, should mean that someone is checking each stick manually and the others are packaged without any testing?

And about the Samsung or Hynix die, thanks, I'll google about that.

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