Jump to content

Why did thermal pad die out?

Hey, I saw previosly a lot of hype around thermal pad from almost all youtuber. So since it is more consistent (based on the degrees you might get for putting to much thermal paste or to little), last for a longer time, and only a few degrees from some of the best thermal paste out there, my question generally is: Why did it die out? Is it simply that people are used to thermal paste and not really into changing to something not fully tested yet? Or that there are problems within the pad? Maybe even a third thing I havent thought about yet?

 

Link to comment
https://linustechtips.com/topic/1107869-why-did-thermal-pad-die-out/
Share on other sites

Link to post
Share on other sites

3 minutes ago, zengara said:

and only a few degrees from some of the best thermal paste out there,

WTF no. You can compress thermal paste down to 0.01mm, not thermal pad. There are not interchangable.

 

3 minutes ago, zengara said:

Why did it die out?

Never, it has stayed around on lower heat output components like powerstages, mosfets and memory chips.

CPU: i7-2600K 4751MHz 1.44V (software) --> 1.47V at the back of the socket Motherboard: Asrock Z77 Extreme4 (BCLK: 103.3MHz) CPU Cooler: Noctua NH-D15 RAM: Adata XPG 2x8GB DDR3 (XMP: 2133MHz 10-11-11-30 CR2, custom: 2203MHz 10-11-10-26 CR1 tRFC:230 tREFI:14000) GPU: Asus GTX 1070 Dual (Super Jetstream vbios, +70(2025-2088MHz)/+400(8.8Gbps)) SSD: Samsung 840 Pro 256GB (main boot drive), Transcend SSD370 128GB PSU: Seasonic X-660 80+ Gold Case: Antec P110 Silent, 5 intakes 1 exhaust Monitor: AOC G2460PF 1080p 144Hz (150Hz max w/ DP, 121Hz max w/ HDMI) TN panel Keyboard: Logitech G610 Orion (Cherry MX Blue) with SteelSeries Apex M260 keycaps Mouse: BenQ Zowie FK1

 

Model: HP Omen 17 17-an110ca CPU: i7-8750H (0.125V core & cache, 50mV SA undervolt) GPU: GTX 1060 6GB Mobile (+80/+450, 1650MHz~1750MHz 0.78V~0.85V) RAM: 8+8GB DDR4-2400 18-17-17-39 2T Storage: HP EX920 1TB PCIe x4 M.2 SSD + Crucial MX500 1TB 2.5" SATA SSD, 128GB Toshiba PCIe x2 M.2 SSD (KBG30ZMV128G) gone cooking externally, 1TB Seagate 7200RPM 2.5" HDD (ST1000LM049-2GH172) left outside Monitor: 1080p 126Hz IPS G-sync

 

Desktop benching:

Cinebench R15 Single thread:168 Multi-thread: 833 

SuperPi (v1.5 from Techpowerup, PI value output) 16K: 0.100s 1M: 8.255s 32M: 7m 45.93s

Link to post
Share on other sites

6 minutes ago, Jurrunio said:

WTF no. You can compress thermal paste down to 0.01mm, not thermal pad. There are not interchangable.

 

Never, it has stayed around on lower heat output components like powerstages, mosfets and memory chips.

He means the graphite thermal pad things that you can use interchangeably with thermal paste.

USEFUL LINKS:

PSU Tier List F@H stats

Link to post
Share on other sites

A thin layer of thermal paste will be better than majority of thermal pads.

Thermal pads can't fill in gaps or microscopic depressions ... imagine a chip with some printed text or something laser engraved (text in depression)... pad would sit on top of surface and you'll have particles of air in the depressions made by the laser etch

Thermal pads are good in places where you want a heatsink to cover two or more chips of different heights. For example, let's say you have a mosfet that's 0.4mm tall and some other chip that's 0.5mm and the heatsink is at 0.75mm height from the circuit board : you can use a 0.5mm thick pad to help transfer heat ... pad will compress to 0.75mm-0.4mm = 0.35mm on the mosfet and down to 0.25mm over the chip.

Link to post
Share on other sites

8 minutes ago, TheRandomness said:

He means the graphite thermal pad things that you can use interchangeably with thermal paste.

doesnt change the argument. even godlike pads are thicker than paste (if applied properly, which does need more skill than just laying a pad on your CPU).

 

and these thin graphite pads do not mix with slightly concave baseplates on many coolers, you're left with a sizeable area on the middle without contact.

CPU: i7-2600K 4751MHz 1.44V (software) --> 1.47V at the back of the socket Motherboard: Asrock Z77 Extreme4 (BCLK: 103.3MHz) CPU Cooler: Noctua NH-D15 RAM: Adata XPG 2x8GB DDR3 (XMP: 2133MHz 10-11-11-30 CR2, custom: 2203MHz 10-11-10-26 CR1 tRFC:230 tREFI:14000) GPU: Asus GTX 1070 Dual (Super Jetstream vbios, +70(2025-2088MHz)/+400(8.8Gbps)) SSD: Samsung 840 Pro 256GB (main boot drive), Transcend SSD370 128GB PSU: Seasonic X-660 80+ Gold Case: Antec P110 Silent, 5 intakes 1 exhaust Monitor: AOC G2460PF 1080p 144Hz (150Hz max w/ DP, 121Hz max w/ HDMI) TN panel Keyboard: Logitech G610 Orion (Cherry MX Blue) with SteelSeries Apex M260 keycaps Mouse: BenQ Zowie FK1

 

Model: HP Omen 17 17-an110ca CPU: i7-8750H (0.125V core & cache, 50mV SA undervolt) GPU: GTX 1060 6GB Mobile (+80/+450, 1650MHz~1750MHz 0.78V~0.85V) RAM: 8+8GB DDR4-2400 18-17-17-39 2T Storage: HP EX920 1TB PCIe x4 M.2 SSD + Crucial MX500 1TB 2.5" SATA SSD, 128GB Toshiba PCIe x2 M.2 SSD (KBG30ZMV128G) gone cooking externally, 1TB Seagate 7200RPM 2.5" HDD (ST1000LM049-2GH172) left outside Monitor: 1080p 126Hz IPS G-sync

 

Desktop benching:

Cinebench R15 Single thread:168 Multi-thread: 833 

SuperPi (v1.5 from Techpowerup, PI value output) 16K: 0.100s 1M: 8.255s 32M: 7m 45.93s

Link to post
Share on other sites

16 minutes ago, Jurrunio said:

doesnt change the argument. even godlike pads are thicker than paste (if applied properly, which does need more skill than just laying a pad on your CPU).

 

and these thin graphite pads do not mix with slightly concave baseplates on many coolers, you're left with a sizeable area on the middle without contact.

Yeah, Linus said so himself on this video. And proved it as well. Basically, did it just die out because people are more used to paste/not knowing about it and its capabilities. Or is there some hidden mistake behind it? (Personally thinking about buying it, cleaning up the gue after 2-3 months is kind of annoying). 

But also, this would make mistakes like air bubbles/too much thermal paste, to little not get in the way of readings which would make everything more stable, or no?

 

Link to post
Share on other sites

They're costly and aren't infinitely reusable. As they're compressed to fit the imperfections of the cooler base and IHS, they wear out and don't perform as well. 

PugetSystems has a nice article on this: https://www.pugetsystems.com/blog/2018/12/03/Graphite-Pads-vs-Thermal-Paste-Which-Is-Better-1292/

If you ever need help with a build, read the following before posting: http://linustechtips.com/main/topic/3061-build-plan-thread-recommendations-please-read-before-posting/
Also, make sure to quote a post or tag a member when replying or else they won't get a notification that you replied to them.

Link to post
Share on other sites

Create an account or sign in to comment

You need to be a member in order to leave a comment

Create an account

Sign up for a new account in our community. It's easy!

Register a new account

Sign in

Already have an account? Sign in here.

Sign In Now

×