Ryzen 3000 to get a soldered IHS

[LukeSavenije]

Sources: Guru3D, @Stefan Payne

 

Some news from the AMD front today. AMD Ryzen 3000 series processors will feature a soldered integrated heat spreader (IHS). This comes at no surprise as the previous AMD Ryzen processors also featured a soldered IHS. A soldered IHS for the heat dissipation of the processor overall is better than using paste. Intel only uses soldered ihs for their current high end 9th gen processors.

 

This has been confirmed by Robert Hallock (Senior Technical Marketing of the CPU/APU part of AMD)

 

This sounds good from one side, as paste is generally worse, but delitting will be a bit harder now.

[Stefan Payne]

Do I get famous now??

Anyway, good to see that they continue to solder the Chips.

 

Paste might be OK for sub 100€ Chips with low Power Consumption but we're talking about 200€+ Chips, they should be soldered.

[LukeSavenije]

2 minutes ago, Stefan Payne said:

Do I get famous now??

 

[dgsddfgdfhgs]

amd is doing the good job as always... how is this tech new?

the only question is will the low end ryzen be soldered

[LukeSavenije]

Just now, dgsddfgdfhgs said:

the only question is will the low end ryzen be soldered

would be weird... but possible

[Uptivuptiz]

Soldered IHS?

[GoldenLag]

13 minutes ago, dgsddfgdfhgs said:

amd is doing the good job as always... how is this tech new?

the only question is will the low end ryzen be soldered

its a good question because soldering small dies is harder than soldering large ones. its one of the reasons Intel stopped soldering. 

 

and the reason why the 9900k die is super thick. like twice as thick as the 8700k die. 

[leadeater]

23 minutes ago, LukeSavenije said:

but delitting will be a bit harder now

No point, it's soldered. Even with LN2 it only really matters on bad solder jobs otherwise it's fine there too.

[LukeSavenije]

2 minutes ago, VegetableStu said:

how would one delid that thing?

with some advanced tools to say the least

[LukeSavenije]

Just now, leadeater said:

No point, it's soldered. Even with LN2 it only really matters on bad solder jobs otherwise it's fine there too.

the small things can make a difference

[leadeater]

2 minutes ago, LukeSavenije said:

the small things can make a difference

It only matters for LN2 if you get solder cracking and delamination between the IHS and die otherwise there's no actual benefit. That's the only reason you would, to avoid contact gaps.

[LukeSavenije]

1 minute ago, leadeater said:

It only matters for LN2 if you get solder cracking and delamination between the IHS and die otherwise there's no actual benefit. That's the only reason you would, to avoid contact gaps.

touche

[GoldenLag]

18 minutes ago, leadeater said:

It only matters for LN2 if you get solder cracking and delamination between the IHS and die otherwise there's no actual benefit. That's the only reason you would, to avoid contact gaps.

and if you are doing propper LN2/helium/hydrogen overclocking you want to sand down the die aswell to remove as much as possible material with bad conductivity. 

[leadeater]

8 minutes ago, LukeSavenije said:

touche

Well re-reading the info on it it could actually be a problem for Zen 2, all down to that chiplet being so small.

 

Quote

Void and micro crack occurrence is mainly affected by the solder area – thus the DIE size. Small DIE size (below 130 mm²) e. g. Skylake will facilitate the void occurence significantly. However, CPUs with a medium to large DIE size (above 270 mm²) e. g. Haswell-E show no significant increase of micro cracking during thermal cycling

Lazy so someone can post how big the Zen 2 chiplet is but I'm betting it's below 130mm².

[LukeSavenije]

4 minutes ago, leadeater said:

Lazy so someone can post how big the Zen 2 chiplet is but I'm betting it's below 130mm².

for epyc rome the chiplets are estimated to be 70-78mm²

 

so i assume it's the same for zen2

[GoldenLag]

9 minutes ago, leadeater said:

Lazy so someone can post how big the Zen 2 chiplet is but I'm betting it's below 130mm².

Around 70-80 mm^2

 

So AMD is probably quite confident in their soldering.

[GoldenLag]

20 minutes ago, leadeater said:

Well re-reading the info on it it could actually be a problem for Zen 2, all down to that chiplet being so small.

Another issue is offcenter and unevem heating. How will this affect the 12 core part?

 

 

Also does placing 2 ciplets next to eachother help solder yields? If so, how does this affect single chips models?

[Bouzoo]

31 minutes ago, leadeater said:

No point, it's soldered. Even with LN2 it only really matters on bad solder jobs otherwise it's fine there too.

Pfffffft, delid, resolder, own it like a ***** it is. What is this, beginners club?

[Quadriplegic]

9 minutes ago, Bouzoo said:

Pfffffft, delid, resolder, own it like a ***** it is. What is this, beginners club?

Or be a man and run direct die cooling.

[Bouzoo]

Just now, Quadriplegic said:

Or be a man and run direct die cooling.

What did you just call me?

[Quadriplegic]

5 minutes ago, Bouzoo said:

What did you just call me?

Inferior #delidandresolderyourchippeasantrace

[LukeSavenije]

11 minutes ago, Quadriplegic said:

Or be a man and run direct die cooling.

be a man and just run it without cooling while baking a steak on it

[leadeater]

2 minutes ago, LukeSavenije said:

be a man and just run it without cooling while baking a steak on it

Just throw it all in a tub of 3M novec

[Bouzoo]

4 minutes ago, leadeater said:

Just throw it all in a tub of 3M novec

Now you're pushing it. I have no idea what that is. 

[leadeater]

Just now, Bouzoo said:

Now you're pushing it. I have no idea what that is.