You can see at 7:20 that the layer of compound is tens or hundreds of microns thicker than that of the previously applied liquid NT-H1.
This is far thicker than normal when it is applied to intel CPUs, as you can see at 2:30.
I'm not sure if you guys are aware of how heat transfer works, but the 'm' in w/mk is a measure of distance, so the performance of the paste is inversely proportional to the thickness of application.
If the layer of 'stuff' you put on the CPU was 100 microns thick compared to a 1 micron layer of NT-H1, you can expect a 100x thermal transfer difference.
You basically replaced some variables with even more variables in this test.
A proper way of doing this test would be to
A) obtain the thermal compound used in intel CPUs in its LIQUID form, not after it has dried
B) fill two low-thermally-conductive tubes several cm long with each thermal compound, NT-H1 and the intel compound
C) place a heating element/resistor in one end of each of the tubes inside the thermal compound
D) place a temperature probe in all 4 ends of the two tubes
E) adjust the power to the resistors until you get the same temperature values on the resistor ends
F) measure the temperature on the opposite end
G) calculate the w/mk to see the real difference in thermal performance
If you can't obtain the real thermal paste in liquid form, then measuring the temperature of the CPU before being delidded, then after delidding with the new compound, is still a much more accurate way of measuring the performance difference.
The thickness of the original layer of material will be almost identical to the thickness when you replace it with the new NT-H1, since the NT-H1 is still liquid.
The only thing that bothers me (So far) is that the "All Apps" is open by default in the Start Menu.
Oh and the "Active Hours" under Windows Update. I wish it wouldn't download updates during those. It's very annoying trying to play CS:GO with an update downloading in the background when you have a terrible Internet connection.