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JEDEC updates HBM standard - press release

zMeul

source: https://www.jedec.org/news/pressreleases/jedec-updates-groundbreaking-high-bandwidth-memory-hbm-standard
 

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ARLINGTON, Va., USA – JANUARY 12, 2016 – JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of an update to JESD235 High Bandwidth Memory (HBM) DRAM standard. HBM DRAM is used in Graphics, High Performance Computing, Server, Networking and Client applications where peak bandwidth, bandwidth per watt, and capacity per area are valued metrics to a solution’s success in the market. The standard was developed and updated with support from leading GPU and CPU developers to extend the system bandwidth growth curve beyond levels supported by traditional discrete packaged memory. JESD235A is available for free download from the JEDEC website.

JESD235A leverages Wide I/O and TSV technologies to support up to 8 GB per device at speeds up to 256 GB/s. This bandwidth is delivered across a 1024-bit wide device interface that is divided into 8 independent channels on each DRAM stack. The standard supports 2-high, 4-high and 8-high TSV stacks of DRAM at full bandwidth to allow systems flexibility on capacity requirements from 1 GB – 8 GB per stack.

Additional improvements in the recent update include a new pseudo channel architecture to improve effective bandwidth, and clarifications and enhancements to the test features. JESD235A also defines a new feature to alert controllers when DRAM temperatures have exceeded a level considered acceptable for reliable operation so that the controller can take appropriate steps to return the system to normal operation.

“GPUs and CPUs continue to drive demand for more memory bandwidth and capacity, amid increasing display resolutions and the growth in computing datasets. HBM provides a compelling solution to reduce the IO power and memory footprint for our most demanding applications,” said Barry Wagner, JEDEC HBM Task Group Chairman.


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who is JEDEC?

Solid State Technology Association, formerly known as the Joint Electron Device Engineering Council (JEDEC), is an independent semiconductor engineering trade organization and standardization body
JEDEC was founded in 1958 as a joint activity between EIA (Electronic Industries Alliance) and the National Electrical Manufacturers Association (NEMA) to develop standards for semiconductor devices. NEMA discontinued its involvement in 1979

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what is HBM?

High Bandwidth Memory is a type of DRAM jointly developed by AMD and Hynix as a competing product to Intel's and Micron's Hybrid Memory Cube
HBM has been adopted as a standard by JEDEC in 2013 under JESD235 nomenclature
the 1st products to utilize HBM were the AMD's Fury lineup utilizing the Fiji GPUs

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It would be interesting to see CPUS with built in HBM and then you could expand it with additional RAM sticks, although data transfer over that distance might be a bit difficult...

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It would be interesting to see CPUS with built in HBM and then you could expand it with additional RAM sticks, although data transfer over that distance might be a bit difficult...

Certainly would be interesting, but just imagining prices of those CPUs is pretty scary.

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Certainly would be interesting, but just imagining prices of those CPUs is pretty scary.

Ya but the sick performance would also be scary

 

If AMD pulled something like that and made some really high end chips, they could certainly get a good income from enthusiasts who want the best, and it if can outperform intel, well....

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It would be interesting to see CPUS with built in HBM and then you could expand it with additional RAM sticks, although data transfer over that distance might be a bit difficult...

 

AMD could make some APUs with 4GB of HBM, but it'll really be 3.5GB.

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It would be interesting to see CPUS with built in HBM and then you could expand it with additional RAM sticks, although data transfer over that distance might be a bit difficult...

gonna happen. just wait for AMDs upcoming APUs. i'm 75% sure they will feature HBM in some form

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I remember that. GG AMD. 

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Ya but the sick performance would also be scary

 

If AMD pulled something like that and made some really high end chips, they could certainly get a good income from enthusiasts who want the best, and it if can outperform intel, well....

 

 

APU's might be a more feasible thing 

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Good, now to wait for products utilizing hbm2

Error: 451                             

I'm not copying helping, really :P

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I wonder will flagship GPI with HBM2 be with 16GB though.

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So what was the change?

Watching Intel have competition is like watching a headless chicken trying to get out of a mine field

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So what was the change?

 

3.5GB

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JEDEC is the standards committee that manages a lot of memory technology standards and revisions including DDR/2/3/4, GDDR3/4/5, HBM/2, Wide-IO, and others. It includes Intel, Samsung, AMD, Nvidia, Hynix, Elpida, and others.

Software Engineer for Suncorp (Australia), Computer Tech Enthusiast, Miami University Graduate, Nerd

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So what was the change?

Allowing a 2GB configuration per stack.

Software Engineer for Suncorp (Australia), Computer Tech Enthusiast, Miami University Graduate, Nerd

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It would be interesting to see CPUS with built in HBM and then you could expand it with additional RAM sticks, although data transfer over that distance might be a bit difficult...

I imagine this will happen in the future. However unless there's at least 16 Gb on the CPU die itself, there'd have to be some motherboard/chipset or OS kungfu trickery if there was traditional ram in addition to the HBM on the CPU die

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JESD235A also defines a new feature to alert controllers when DRAM temperatures have exceeded a level considered acceptable for reliable operation so that the controller can take appropriate steps to return the system to normal operation.

 

Holely socks batman!  So throttling RAM could be an actual thing for normal people?  Guess the cooler market is going to change quite a bit in the coming years.

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It would be interesting to see CPUS with built in HBM and then you could expand it with additional RAM sticks, although data transfer over that distance might be a bit difficult...

Crystal Well anyone ?

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