10 minutes ago, Escade said:
thank you for the answer, ohh i tought it's b-die from this b-die finder https://benzhaomin.github.io/bdiefinder/ and this discussion comment
All G.Skill 2800 MHz+ 16GB modules are Samsung B-die.
F4-3600C17Q-64GTZR consists of 4x F4-3600C17-16GTZR modules so it's the same as 2x F4-3600C17D-32GTZR kits. That's why I don't list 64GB kits because it is the same as 2x 32GB kits (at least for G.Skill).
G.Skill Trident Z RGB: F4-3600C17D-32GTZR (2x16GB 3600) has Samsung B-Die! http://rgho.st/6gHMnCdSy.view
Outdated. Hynix and Micron only started shipping their high frequency capable dies (beyond 3466MHz) since very late 2018 to mid 2019, before that Samsung B-die are everywhere but after that, most are Hynix CJR (since Micron seems to supply less to other brands). Btw the other Samsung dies listed, E-die is another high frequency legend (but runs loose tRP and tRCD like CJR and Rev E) while D die clocked poorly and discontinued before Skylake even is a thing. As a result, only common in X99 builds.
so i need to choose between high speed memory or large memory ?
Yes. Going fast and carrying a lot don't mix, just like a vehicle with only 4 wheels. You could choose to make a fast race car or a van capable of moving everything you have, just not both.