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Arkyo0

Do I heat the package to get the die out of it?

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I don't think you can remove the die from the substrate.


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Posted · Original PosterOP
1 minute ago, Theguywhobea said:

I don't think you can remove the die from the substrate.

No , u can do it for sure.

YouTube

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Posted · Original PosterOP
42 minutes ago, aaradorn said:

I think flux and a good heatgun should do the job. Why do you want to remove the computing core anyway?

I just want to expose the bottom layer , then seal the entire die with some plastic to make it look like a treasure

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Definitely a heat gun. You also might be able to get away with turning it upside down in a high temp oven, but I wouldn't be super confident in that. If you're planning to do what the guy in that video was doing be way more careful with the etching fluid than he was, that stuff is unbelievably nasty.


¯\_(ツ)_/¯

 

 

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Posted · Original PosterOP
23 minutes ago, BobVonBob said:

Definitely a heat gun. You also might be able to get away with turning it upside down in a high temp oven, but I wouldn't be super confident in that. If you're planning to do what the guy in that video was doing be way more careful with the etching fluid than he was, that stuff is unbelievably nasty.

But the vid uses a pan to heat it

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31 minutes ago, BobVonBob said:

You also might be able to get away with turning it upside down in a high temp oven, but I wouldn't be super confident in that.

Works for me. I always harvest mainboards this way.

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