Is TG Kryonaut "pump out" a real issue?

[Bitter]

I'm researching thermal compounds because I haven't updated myself since AS5 was the "go-to" stuff, and I'm seeing some people reporting problems with Kryonaut (KN from here on out) pressing out from between cooler and die/heat spreader especially under higher temps (over 80C) and under higher clamp loads. I've been using AS5 for a very long time and have pulled off coolers that have been installed for a decade with it and it's just slightly thickened but still in a nice layer and has never pushed out or broken down in anyway I can see. I'm looking at the performance vs time proposition here, if AS5 isn't as thermally conductive as KN but it holds it's performance vs KN being higher performance but with poorer stability then for me AS5 is the clear winner due to stability and reasonably good performance. 

 

Thoughts? Opinions? Tests? I welcome some good discussion on this, opinions and antecedotes are welcome and appreciated but facts are more highly valued.

[_Hustler_One_]

Kryonaut is a thick compound, I think it's best to apply it by spreading it on the IHS, just like how Der8auer recommended..

 

I also use this TIM by spreading it, running happy temps.. 

[Tristerin]

4 hours ago, Bitter said:

I'm researching thermal compounds because I haven't updated myself since AS5 was the "go-to" stuff, and I'm seeing some people reporting problems with Kryonaut (KN from here on out) pressing out from between cooler and die/heat spreader especially under higher temps (over 80C) and under higher clamp loads. I've been using AS5 for a very long time and have pulled off coolers that have been installed for a decade with it and it's just slightly thickened but still in a nice layer and has never pushed out or broken down in anyway I can see. I'm looking at the performance vs time proposition here, if AS5 isn't as thermally conductive as KN but it holds it's performance vs KN being higher performance but with poorer stability then for me AS5 is the clear winner due to stability and reasonably good performance. 

 

Thoughts? Opinions? Tests? I welcome some good discussion on this, opinions and antecedotes are welcome and appreciated but facts are more highly valued.

Just applied it Friday night, pushed FX 8350 to 4.7ghz, crashed system due to overheat a couple times, checked - as beautifully spread on as when I put it on.  So I cant say WONT, but I applied it per the instructions and got it as hot as it will see for a little bit and no changes.

 

I am IN LOVE with it - dropped my (at stock) temps by 5c CPU and 3c socket temps.  Ill never go back unless I cant afford it lol

[Tristerin]

@Bitter in the Reviews subsection of LTT, I just did my review after a 1 hour torture test under stock loads (4.2ghz turbo) on this thermal paste with before temps after temps etc, should go check it out 

 

 

[aezakmi]

26 minutes ago, Tristerin said:

Just applied it Friday night, pushed FX 8350 to 4.7ghz, crashed system due to overheat a couple times, checked - as beautifully spread on as when I put it on.  So I cant say WONT, but I applied it per the instructions and got it as hot as it will see for a little bit and no changes.

 

I am IN LOVE with it - dropped my (at stock) temps by 5c CPU and 3c socket temps.  Ill never go back unless I cant afford it lol

with what cooler?

 

I pushed an 8350 up to to 4.950 (1.43) using mayo paste which was the only one I had atm

then used MX4 and temps were THE SAME, guess I got scammed.

[Tristerin]

2 minutes ago, aezakmi said:

with what cooler?

 

I pushed an 8350 up to to 4.950 (1.43) using mayo paste which was the only one I had atm

then used MX4 and temps were THE SAME, guess I got scammed.

Corsair H100i GTX 240mm AIO (my stock temps are insanely cold, see sig) - the problem is my overclock, Im a total nub.  Played with LOTS of settings...got it very hot..didn't fry anything though!  My mobo gives me lots of options lol.  The stability was good (I played a couple games on it no problem) my temps were insane...Im doing something wrong with the power delivery for sure or something (again, real nub to overclocking)

[aezakmi]

12 minutes ago, Tristerin said:

Corsair H100i GTX 240mm AIO (my stock temps are insanely cold, see sig) - the problem is my overclock, Im a total nub.  Played with LOTS of settings...got it very hot..didn't fry anything though!  My mobo gives me lots of options lol.  The stability was good (I played a couple games on it no problem) my temps were insane...Im doing something wrong with the power delivery for sure or something (again, real nub to overclocking)

FXs benefit more from FSB bump than from mult oc, temps shouldn't be a problem with that cooler though, max on my old 8350 was 70C overclocked and everything was stable, the case was a space heater though but the CPU had an acceptable temp 

[Tristerin]

4 minutes ago, aezakmi said:

FXs benefit more from FSB bump than from mult oc, temps shouldn't be a problem with that cooler though, max on my old 8350 was 70C overclocked and everything was stable, the case was a space heater though but the CPU had an acceptable temp 

Ive only tried twice now and each time overload the temps, going to try again next weekend, will keep this in mind, any tips you want to PM me would be appreciated

[Bitter]

I always have spread thermal compound from back in the days of Socket 370 (before that it wasn't really a thing needed), I have a spring steel small diameter 'wire' which is perfectly straight with a little handle of wire bent off of it that I used to spread the compound with as little wasted as possible. I apply a dot then use the steel spreader to pull it across the die from the center outward and then spread across the die to even the surface and make a perfectly uniform perfectly smooth layer of compound that's as thin as possible with zero disturbances in it's surface. My application is perfect every time with my own weird method I've come up with over the years. Spatulas and spreaders create uneven application which can create air pockets and thick/thin spots and build up expensive compound (remember, AS5 used to cost A LOT more than it does now) on their edges. The round steel spring wire has no edges.

 

Anyway, this is all great talk and information, but doesn't really deal with long term performance. I'm a 'set it and forget it' kind of guy. I want great performance, yes, but I also want to keep great performance. Obviously something like liquid metal would be the be all end all here but there's constraints on it's use and concerns about it's interactions with copper long term, especially concerns with use in a laptop.

[aezakmi]

16 hours ago, Tristerin said:

Ive only tried twice now and each time overload the temps, going to try again next weekend, will keep this in mind, any tips you want to PM me would be appreciated

I still have it, well my sister has it but I could run a couple of test 

[markr54632]

21 hours ago, Bitter said:

I always have spread thermal compound from back in the days of Socket 370 (before that it wasn't really a thing needed), I have a spring steel small diameter 'wire' which is perfectly straight with a little handle of wire bent off of it that I used to spread the compound with as little wasted as possible. I apply a dot then use the steel spreader to pull it across the die from the center outward and then spread across the die to even the surface and make a perfectly uniform perfectly smooth layer of compound that's as thin as possible with zero disturbances in it's surface. My application is perfect every time with my own weird method I've come up with over the years. Spatulas and spreaders create uneven application which can create air pockets and thick/thin spots and build up expensive compound (remember, AS5 used to cost A LOT more than it does now) on their edges. The round steel spring wire has no edges.

 

Anyway, this is all great talk and information, but doesn't really deal with long term performance. I'm a 'set it and forget it' kind of guy. I want great performance, yes, but I also want to keep great performance. Obviously something like liquid metal would be the be all end all here but there's constraints on it's use and concerns about it's interactions with copper long term, especially concerns with use in a laptop.

On a desktop processor with ihs not at all. On bare die applications like laptops or gpu's absolutely it is an issue.

[Bitter]

Is that because of the finely polished surface vs two surfaces which have slight imperfections that 'hold' the compound in place? I can't recall if I've ever re-visited a bare die I did AS5 on but I can't recall having any issues with one either. I think maybe old 9800GT I pulled off a long time after doing AS5 and it was still in place fine. I guess I'll give KN a shot with IHS stuff like my Chinese 4980HQ and find something else for bare die stuff like the 4980HQ in her MacBookPro not that it would make a lot of difference, I don't think there's enough heat sink or airflow there.