ArunMKumar

checked on this. Drilling and cutting seems too much for me. The first 2 seems feasible. 1. Leaving the way it is : sounds good to me, I ran the stress utility on linux for 10 minutes, and checked the temps. never crossed 70, maintained a decent 65-68 degrees. stock cooler used to go above 80. at that point the core frequencies dropped. 2. changing the airflow : opened the cabinet to see its feasibility, yes it could be done. From what I could see it actually made more sense for this chassis. will try once I get hold of mounting screws. Thanks for the advice, I am in better state of mind than before.

I am using a Thinkstation P330, which has bay doors for mounting HDD. I bought a cooler master H410 RGB to go with it (RGB fanboy ), The installation went well. Now when. I close the bay door, one of the brackets for the 3.5 inch drive pushes against the fan and causes the entire Heat sink + fan assembly to move back by around 4mm at the top. I do not need that bracket as I do not plan on using the DVD drive or the secondary 3.5 HDD mount. It is not screwed but riveted to the frame I measured the bend.. The top of the heat-pipes moves back by 4mm, for a 136mm tall cooler. The angle would be around 2 degrees at the brackets pulling on one set and pushing on another. would this be a cause of concern with the contact patch with the CPU?? consider or, is it going to put extra tension on the mounting brackets? This Cooler comes with a snap on fan, If i switch the fan to the other direction the problem would be solved. but then the CPU fan wold be sucking in air from the back instead of pushing out. I could not find a 92mm variety of snap on fan which could be used to push air away from the heat sink, to be mounted on the back. Socket : LGA1151

found this on the product page for the Intel Wifi 6 kit. https://www.newegg.com/global/in-en/intel-wi-fi-6-ax200/p/N82E16833106102 for AX200: Your PC will need an open M.2 slot (key E for Wi-Fi) on your motherboard. This product is supported by Intel® Core™ 8th, 9th and 10th gen processors. if only key 'E' is needed, then it makes the connector having only the 'E' key compatible with 9560 9260 AX200 AX201 and so on... what it boils down to is the CNVI support, AX201 with CNVI2 is not backward compatible with CNVI (strange). and CNVI and CNVI2 support is based on the chipset. had a look at the data-sheets of C200 and C400 and their CNVI implementation. It gives an overall description of the signals and Pins to use. It does not discuss stuff in detail but here is what I have for observations: 400 chipset has 1 additional signal than the C300 chipsets and renames 3 non-CNVi to CNVi pins and adds one more, this usually should mean that the functionality is changing. These pins do not have any CNVi functionality in the 300 series chipset, and control bluetooth through a I2S bus. but now are included as part of CNVi Pins. my guess is the newer CNVio2 devices (AX201) are expecting a different signal/protocol on these pins with the same layout on the connector and hence resulting in no-POST. instead of adding pins with versions as we see in PCI-E, here we see a repurpose of the existing signals, its a revamp of the protocol rather than a upgrade. of course it is going to break things. like the moving from DVD to Blu-ray, you would need to buy a blu-ray player to use that. is this fixable with a BIOS update? depends on what has changed into CNVio2, if the changes depend on the facilities provided by the newer CPU and the chipset then it might not be possible. Like the blu-ray.

The updated vector processing units have been worked upon for almost a decade. This can possibly come down to the integrated Mali GPU on the sone of the SoC. Adreno being the more prevalent with the snapdragon chips. Not anytime soon though. we can also see more software revisions for the ARM builds of enterprise software in the time to come if this takes off.

From what I know, It will be announced this year. Others will surely try to catch up, HPC competition is fun, we know we would never have such computers at our desk but good to look at those numbers and admire them

not yet, but the technology I believe will surely trio. down to the SoCs, not in the same size or performance. x86 had its power efficiency issues in a mobile environment, which ARM till now has been really good at. The software eco system around ARM has been developed considering low power usage too. Gaming was a bad example.. TBH.. it was to meet the community guidelines. I could not think of something on the fly. This is too early a stage to suggest a commercial use-case.

Fugaku Supercomputers (https://en.wikipedia.org/wiki/Fugaku_(supercomputer)) has achieved 537 petaflops (200 petaflops by the previous Rank #1) of performance. This hasn't created much discussion anywhere since it was announced, but will be soon released in the top 500 list (June 1st week) here is the tweet: https://twitter.com/ProfMatsuoka/status/1261194036276154368?s=20 This, if and when it trips down to the data centre has the ability to integrate the mobile and the server architecture, which the x86 hasn't been able to achieve till now. scalable mobile games anyone? wanted to see what opinions the forum has on it.