jackoneill1984

Thank you! This is something I didn't find on my own. Most things I found said it was the same as but that didn't jive with my testing. Even if it is a sample of one.

Hi, I'm no expert myself, but 3600 Cas 16 memory if you can buy it outright and set the XMP profile in bios is the sweet spot for Ryzen 3rd gen. Right now the prices aren't bad either. I'm sure there are people who know more but from the reviews I've seen that seems to be the consensus.

I wish I could tune the infinity fabric but I can't justify upgrading my processor at the moment. So your gaming plus is handling those timings well? Is it the Max version or the original?.

That's what I've done, the 3466 timings are what I've managed after doing some initial tunning on the primary timings. I haven't used the DRAM calculator for that as it doesn't have my JJR die in there anyways. I have been having a lot of fun doing it on my own working from the XMP as a baseline. Just wanted to get some insight from folks who might have more experience than myself. I'd try Reddit, but I've seen how they can treat boobs like myself.

I read a post by Stilts (apparently he's good at this) and he mentioned that the Integrated memory controller on Zen+ can go up to 3533 on a large sample of chips. I guess I'm just wondering about the timings. They seem to be all over the place. 15 18 19 17 at 3466 seems wacky based on my knowledge level. I spose if it works it works then lol.

Recently started tuning my memory kit I bought when I built my PC. I'm getting some weird results using the DRAM calculator for Ryzen. The timings work and using Prime95 large ffts and haven't had any issues. Memory stats from thaiphoon are below. Along with the current "stable" timings. Module Manufacturer: Undefined Module Part Number: Undefined DRAM Manufacturer: Hynix DRAM Component: H5AN8G8N??R-UHC* *According to the chips themselves they are H5AN8G8NJJR-VKC I had to remove the heat spreader to look at the chips.* DRAM Die Revision / Process Node: FFh / Not determined Module Manufacturing Date: Week 15, 2019 Manufacturing Date Decoded: April 8-12, 2019 Module Serial Number: 0104AA1Bh Module PCB Revision: 00h Fundamental Memory Class: DDR4 SDRAM Module Speed Grade: DDR4-2400R Base Module Type: UDIMM (133.35 mm) Module Capacity: 8 GB Reference Raw Card: A2 (8 layers) JEDEC Raw Card Designer: SK hynix Module Nominal Height: 31 H Module Thickness Maximum, Front: 1 T Module Thickness Maximum, Back: T Number of DIMM Ranks: 1 Address Mapping from Edge Connector to DRAM: Standard DRAM Device Package: Standard Monolithic DRAM Device Package Type: 78-ball FBGA DRAM Device Die Count: Single die Signal Loading: Not specified Number of Column Addresses: 10 bits Number of Row Addresses: 16 bits Number of Bank Addresses: 2 bits (4 banks) Bank Group Addressing: 2 bits (4 groups) DRAM Device Width: 8 bits Programmed DRAM Density: 8 Gb Calculated DRAM Density: 8 Gb Number of DRAM components: 8 DRAM Page Size: 1 KB Primary Memory Bus Width: 64 bits Memory Bus Width Extension: 0 bits DRAM Post Package Repair: Supported Soft Post Package Repair: Supported Fine Timebase: 0.001 ns Medium Timebase: 0.125 ns CAS Latencies Supported: 10T, 11T, 12T, 13T, 14T, 15T, 16T, 17T, 18T Minimum Clock Cycle Time (tCK min): 0.833 ns (1200.48 MHz) Maximum Clock Cycle Time (tCK max): 1.600 ns (625.00 MHz) CAS# Latency Time (tAA min): 13.320 ns RAS# to CAS# Delay Time (tRCD min): 13.320 ns Row Precharge Delay Time (tRP min): 13.320 ns Active to Precharge Delay Time (tRAS min): 32.000 ns Act to Act/Refresh Delay Time (tRC min): 45.320 ns Normal Refresh Recovery Delay Time (tRFC1 min): 350.000 ns 2x mode Refresh Recovery Delay Time (tRFC2 min): 260.000 ns 4x mode Refresh Recovery Delay Time (tRFC4 min): 160.000 ns Short Row Active to Row Active Delay (tRRD_S min): 3.300 ns Long Row Active to Row Active Delay (tRRD_L min): 4.900 ns Write Recovery Time (tWR min): 15.000 ns Short Write to Read Command Delay (tWTR_S min): 2.500 ns Long Write to Read Command Delay (tWTR_L min): 7.500 ns Long CAS to CAS Delay Time (tCCD_L min): 5.000 ns Four Active Windows Delay (tFAW min): 21.000 ns Maximum Active Window (tMAW): 8192*tREFI Maximum Activate Count (MAC): Unlimited MAC DRAM VDD 1.20 V operable/endurant: Yes/Yes Module Thermal Sensor: Not Incorporated I've been trying to tune the memory at 3466 which is the maximum spec for my motherboard which is a MSI B450 Gaming Plus paired with a Ryzen 5 2600X. These timings below appear to be stable with Prime95 large FFTs and while gaming they just seem really weird to me. Basically I am just looking for some constructive criticism or some knowledge from people on here as I am an amateur. Hell I didn't know what XMP was a year ago.

I have an NZXT H500 red/black case and have done a great job of causing a big gash on the cable management bar paint showing the white underneath. I contacted NZXT about getting a replacement bar but they don't have any. Was wondering if anyone had any experience repairing something like this and have any recommendations. Basically my OCD wont let me not see the gash, but wont make me cautious enough to not scratch things up in the first place.

Its all business.

Pfft, Windows for Workgroups 3.11 Is were its at. First computer was an old Toshiba laptop, solitaire for life. ?