BiTBiTE

Hm. Maybe altering the flow rate over the TECS would yield results? An external chilled res? 
 
I was just caught off guard because even with every article I've read saying that TECS didn't work in a watercooling loop, I still seen a notable difference in temps when utilizing a TEC placed on my flow meter. 
 
I've already sealed my test board so that one will receive a TEC direct on the Q6600 to see what happens. Max wattage of the Q6600 is 180w. I have a 400w tec in the mail, but it hasn't even left China yet!!
 
I'm going to do some actual testing on my day off. It's the only way to know. The worst that can happen is a learning experience that I'm more than up for. I'll have to order some stuff tho, which could take a while. I'll keep this updated as the testing goes/parts arrive. 

Hey guys!!
Just wanted to fill you in on a project I'm working on. Feel free to chime in with anything that comes to mind. 
Ive been experimenting the past day or so with the TEC modules I finally received; the first was a single 12706 then two 12715's. I'm really intrigued with them. I've sealed a board with an old Q6600 I had laying around and was going to mess around with one directly on the CPU, but then I wondered how it would do in conjunction with my watercooling loop in my main rig. 
I know about the heat dissipation issues of the TECS and am currently using a hyper 212 evo which it's doing the trick. I know (first hand) of the condensation issues,  but with the way it's going to be implemented it puts the TECS on the outside of the case with the evos outside the back. I have an all copper tube build which is modular so it wouldn't take much work to change out one pipe. 
It wouldn't be always powered, rather only when running benchmarks or games and such. 
 
I'm placing the peltiers after my res, before it enters the gpu then cpu. (My cpu/gpu are in a parellel config, which was more for aesthetics but I did try both parallel and series config and seen marginal difference at best.)
The point of the TECS is not to be the main cooling component, rather chilling the water before entering components. As the cold water enters the gpu it will be heated before entering the cpu, negating the need for insulation past the gpu entry. Whatever heat the liquid picks up by the components is then cooled by my Rad, then chilled again before entering the components.
 
I'm oc'd at just shy of 5.2Ghz on my 8600k, really hoping to push this chip to 5.3. It's already delidded with a Rockit copper IHS installed w/ liquid metal. Temps are good; breaking 74 after a few hours of ghost recon wildlands but considering the OC I'm happy. 

Hey guys!!
Just wanted to fill you in on a project I'm working on. Feel free to chime in with anything that comes to mind. 
Ive been experimenting the past day or so with the TEC modules I finally received; the first was a single 12706 then two 12715's. I'm really intrigued with them. I've sealed a board with an old Q6600 I had laying around and was going to mess around with one directly on the CPU, but then I wondered how it would do in conjunction with my watercooling loop in my main rig. 
I know about the heat dissipation issues of the TECS and am currently using a hyper 212 evo which it's doing the trick. I know (first hand) of the condensation issues,  but with the way it's going to be implemented it puts the TECS on the outside of the case with the evos outside the back. I have an all copper tube build which is modular so it wouldn't take much work to change out one pipe. 
It wouldn't be always powered, rather only when running benchmarks or games and such. 
 
I'm placing the peltiers after my res, before it enters the gpu then cpu. (My cpu/gpu are in a parellel config, which was more for aesthetics but I did try both parallel and series config and seen marginal difference at best.)
The point of the TECS is not to be the main cooling component, rather chilling the water before entering components. As the cold water enters the gpu it will be heated before entering the cpu, negating the need for insulation past the gpu entry. Whatever heat the liquid picks up by the components is then cooled by my Rad, then chilled again before entering the components.
 
I'm oc'd at just shy of 5.2Ghz on my 8600k, really hoping to push this chip to 5.3. It's already delidded with a Rockit copper IHS installed w/ liquid metal. Temps are good; breaking 74 after a few hours of ghost recon wildlands but considering the OC I'm happy. 

Hey guys!!
Just wanted to fill you in on a project I'm working on. Feel free to chime in with anything that comes to mind. 
Ive been experimenting the past day or so with the TEC modules I finally received; the first was a single 12706 then two 12715's. I'm really intrigued with them. I've sealed a board with an old Q6600 I had laying around and was going to mess around with one directly on the CPU, but then I wondered how it would do in conjunction with my watercooling loop in my main rig. 
I know about the heat dissipation issues of the TECS and am currently using a hyper 212 evo which it's doing the trick. I know (first hand) of the condensation issues,  but with the way it's going to be implemented it puts the TECS on the outside of the case with the evos outside the back. I have an all copper tube build which is modular so it wouldn't take much work to change out one pipe. 
It wouldn't be always powered, rather only when running benchmarks or games and such. 
 
I'm placing the peltiers after my res, before it enters the gpu then cpu. (My cpu/gpu are in a parellel config, which was more for aesthetics but I did try both parallel and series config and seen marginal difference at best.)
The point of the TECS is not to be the main cooling component, rather chilling the water before entering components. As the cold water enters the gpu it will be heated before entering the cpu, negating the need for insulation past the gpu entry. Whatever heat the liquid picks up by the components is then cooled by my Rad, then chilled again before entering the components.
 
I'm oc'd at just shy of 5.2Ghz on my 8600k, really hoping to push this chip to 5.3. It's already delidded with a Rockit copper IHS installed w/ liquid metal. Temps are good; breaking 74 after a few hours of ghost recon wildlands but considering the OC I'm happy.