Found these things on speccy
Motherboard
SAMSUNG ELECTRONICS CO.LTD Samsung DeskTop System (LGA 1160)
CPU
Intel Core i3 550
Cores 2
Threads 4
Name Intel Core i3 550
Code Name Clarkdale
Package Socket 1156 LGA
Technology 32nm
Specification Intel Core i3 CPU 550 @ 3.20GHz
Family 6
Extended Family 6
Model 5
Extended Model 25
Stepping 5
Revision K0
Instructions MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, NX, VMX
Virtualization Supported, Enabled
Hyperthreading Supported, Enabled
Fan Speed 1097 RPM
Rated Bus Speed 2926.3 MHz
Stock Core Speed 3200 MHz
Stock Bus Speed 133 MHz
Average Temperature 42 °C
Caches
L1 Data Cache Size 2 x 32 KBytes
L1 Instructions Cache Size 2 x 32 KBytes
L2 Unified Cache Size 2 x 256 KBytes
L3 Unified Cache Size 4096 KBytes
Cores
Core 0
Core Speed 1197.1 MHz
Multiplier x 9.0
Bus Speed 133.0 MHz
Rated Bus Speed 2926.3 MHz
Temperature 40 °C
Threads APIC ID: 0, 1
Core 1
Core Speed 1197.1 MHz
Multiplier x 9.0
Bus Speed 133.0 MHz
Rated Bus Speed 2926.3 MHz
Temperature 43 °C
Threads APIC ID: 4, 5
Motherboard
Manufacturer SAMSUNG ELECTRONICS CO.LTD
Model Samsung DeskTop System (LGA 1160)
Version None
Chipset Vendor Intel
Chipset Model Havendale/Clarkdale Host Bridge
Chipset Revision 02
Southbridge Vendor Intel
Southbridge Model H55
Southbridge Revision 06
BIOS
Brand SAMSUNG ELECTRONICS CO.LTD
Version 03OC
Date 11/11/2010
Voltage
+12V 9.531 V
+5V 4.781 V
CPU CORE 2.988 V
VIN3 2.436 V
VIN4 3.012 V
+3.3V 3.507 V
VIN6 1.308 V
VIN7 1.644 V
Hope this helps.
Thank u in advance for looking this up to me