Sorry if this seems trolly and admin remove if not appropriate I'm not trolling g'day I'm new to the forum. and i had a random thought and wanted to know the answer. instead of using thermal paste couldn't "Flux" or Flux Gel" be a liable solution (as a temporary solution) if you don't happen to have thermal paste. because the main reason for flux gel i've used it for as dissipate heat when replacing parts in a circuit board and the per pose for thermal paste is the same to make contact with heat sink. give me reasons to why this would work or wouldn't work thanks.