HOLLiiWOOD

That is awesome. is this setup better than an oil submersion?

I hope to increase the efficiency of the stock cooler with some extra surface area, and by either using a TIM between the plate that sinks heat from the VRM and memory and the vapour chamber cooler, or adding heat sinks to said plate. But it does seem to be that the Gelid GP Extreme Thermal Pads will be everything I need. But I still don't know how to figure out when to go +0.5mm or not

@For Science! original pads are 2mm but I can't find 17w/mk pads in 2mm for less than $400, 100mm x 100mm, when I only need about 60mm x 50mm

@VIVO-US It isn't a very deep indent, on the 2mm pads, and the original pads, I think the actual gap is 1.875mm - 1.768mm ish I haven't opened it up to see how the 1mm cheap pads + 1mm copper shims + thermal paste compares indent wise.

I realize this is a lot to do just to put the stock cooler back on, but I ripped the original pads upon opening it up, and i had originally planned to be able to find pads. yes I could just buy the Gelid pads from quiet pc and wait the week or two for them to arrive. but I want this card to be working in 10+ years (avoid needless electronic buying and using precious metals for no reason, awesome uncle points for sweet hand me down when I do upgrade, etc, etc. . . ) and the Gelid pads would probably be fine for that too but maybe I want to soup up a card in the future, or spend money to enhance a motherboard VRM, or add some real thermal management to a PCI-e SSD

How thick is too thick? I understand that not thick enough reduces mounting pressure; and that mounting pressure, generally, decreases the thermal resistance of the pad. and too much thickness can cause problems with deflection. but where does more become TOO much?? for my current situation: GPU (ASUS TURBO1080TI-11G) Gap is sub 2mm - (measured with crap caliper, by measuring down from the top of the metal plate, used to sink heat away from the VRM and memory chips, to the top of the VRM chips, then subtracting the thickness of the metal [metal thickness it more than 1mm, less than 1.5mm, probably 18 gauge]) 2mm pads leave an indent, and would work. would 2.5mm pads work better? 3mm pads were too big and caused deflection, BUT, would they squish down more after being heated and cooled? would a sandwich of 1.0mm Fujipoly Xr-m (17w/mk) + 1.0mm copper shim + 0.2mm Carbonaut be too thick ( < - my current desire) OR would this only give me that extra mounting pressure needed to reduce thermal resistance. I realize that it is heavily dependant on many factors (pad hardness, pad properties, where pressure in being created, etc. . . ) but I just want to know ball park, is +1mm too much, or is +0.35mm too much

Would there be any difference between using the 2400g or 2200g, other than performance (I'm assuming not, as I believe they are identical architecturally). When I upgrade my PC at work, it will be to a 2400G, and I will be mining it (everything is profitable when you don't pay for power) so when I FINALLY decide to get off of AM3 at work I hope my informations will be valid for both APU SKUs

nearest-neighbor . . . .

I am looking to enlarge some images, both video and static, for additional processing. I am looking for a dumb option: I want one red pixel to turn into a set of 4 red pixels, and the blue pixel beside it to become 4 blue pixels. no colour blending, estimating, nothing just each pixel doubled in length and width. a big blocky picture that I can post-process. I have no idea what word I am looking for.