MkaiL

Maybe add to each tier what they are capable of cooling (tdp) for a better overview?

Maybe add to each tier what they are capable of cooling (tdp) for a better overview?

Maybe add to each tier what they are capable of cooling (tdp) for a better overview?

Maybe add to each tier what they are capable of cooling (tdp) for a better overview?

Maybe add to each tier what they are capable of cooling (tdp) for a better overview?

Came across this picture of the k55, might help you figure it out:

Maybe add to each tier what they are capable of cooling (tdp) for a better overview?

Maybe add to each tier what they are capable of cooling (tdp) for a better overview?

Maybe add to each tier what they are capable of cooling (tdp) for a better overview?

Maybe add to each tier what they are capable of cooling (tdp) for a better overview?

Maybe add to each tier what they are capable of cooling (tdp) for a better overview?

The evolv is known for restricted airflow and most people are modding (cutting) their panels to improve that. I've seen many people do the hexagon shape which looks nice, but imo doesn't really fit the case with those big holes. I still went for the hexagon but a somewhat inverted design, with openings about the same size as the original cutouts on the top. What do you guys think? The case is now ready for the next step: custom waterloop. 

The evolv is known for restricted airflow and most people are modding (cutting) their panels to improve that. I've seen many people do the hexagon shape which looks nice, but imo doesn't really fit the case with those big holes. I still went for the hexagon but a somewhat inverted design, with openings about the same size as the original cutouts on the top. What do you guys think? The case is now ready for the next step: custom waterloop. 

The limiting factor in liquid cooling is not the liquid used to transfer the heat to the radiators, but the amount of energy the radiators can dissipate using air. The fluid is not actually cooling the system, it just transfers the heat so we can have a larger surface area to still air-cool the liquid itself. Changing out the liquid, which is again not the limiting factor, won't improve temps since you'll still have the same radiator surface area dissipating the same amount of energy.

The limiting factor in liquid cooling is not the liquid used to transfer the heat to the radiators, but the amount of energy the radiators can dissipate using air. The fluid is not actually cooling the system, it just transfers the heat so we can have a larger surface area to still air-cool the liquid itself. Changing out the liquid, which is again not the limiting factor, won't improve temps since you'll still have the same radiator surface area dissipating the same amount of energy.

Looks like you removed the wrong pcie bracket cover. You need to remove the lower bracket, not the one above the pcie slot.

Looks like you removed the wrong pcie bracket cover. You need to remove the lower bracket, not the one above the pcie slot.

Looks like you removed the wrong pcie bracket cover. You need to remove the lower bracket, not the one above the pcie slot.

But yours come from a set of 4 that have been tested and are known to work well together (not that it even matters, you can just add another 2x8gb kit later if you want). The fact that you'll only use 2 of the kit makes no difference, unless you have a HEDT or TR system with a quad channel motherboard (not to be confused with 4 dimm slots, which is dual channel). Make sure to utilize the correct dimm slots to enable dual channel configuration and you'll be good to go (check the manual but it's usually the 2nd and 4th slot). Don't forget to enable XMP, DOCP, ... (whatever it's called in your bios) otherwise your sticks will run at default speeds instead of 3200mhz.

But yours come from a set of 4 that have been tested and are known to work well together (not that it even matters, you can just add another 2x8gb kit later if you want). The fact that you'll only use 2 of the kit makes no difference, unless you have a HEDT or TR system with a quad channel motherboard (not to be confused with 4 dimm slots, which is dual channel). Make sure to utilize the correct dimm slots to enable dual channel configuration and you'll be good to go (check the manual but it's usually the 2nd and 4th slot). Don't forget to enable XMP, DOCP, ... (whatever it's called in your bios) otherwise your sticks will run at default speeds instead of 3200mhz.

It makes zero difference, you'll get the same performance.

It makes zero difference, you'll get the same performance.

Any source that confirms this? Afaik, barrow just copied bitspowers design and now everyone seems to blindly claim they are their oem. From what I can find, Barrow fittings are made in China whereas bitspowers production is based in Taiwan. If they were oem, they would just be rebranded, but you see quite a few design differences (dimensions, o-rings, finish).
I've used both brands in the past and even though Barrow makes great fittings, Bitspower still has better quality imho, especially noticeable with rotary fittings. I'm just not sure the price difference is worth it.
 
Directly from Bitspowers website:

 
Put the drain in the lowest point of your loop. You can use a Y or T splitter and add it by the res or somewhere else. Do note that with a U-flow rad in the front, draining the loop is going to be difficult no matter what and you'll have to rotate the case in some weird angles and even then might not succeed. You can get x-flow rads to make it easier or I've seen people put the ports on the bottom and use a drain on both ports to easily empty the loop.

Who could ve guessed that ubi servers would shit themselves 😒🙄

Most compact of them all: Samsung galaxy s10e, seems to be what you're looking for. 5,8" screen, has great specs and can be found for a good price.
 
The problem with the pixel 3a, even though it has a 5,6" screen, are the bezels that still make the phone big.