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can I use bondo? nes build

ungreedy

I was wondering if I can use bondo on the bottom of my case to flush it out? It is a nes case with a lexan motherboard tray epoxied on, scuffed up with 60 grit sandpaper.I am worried about cracking if I use bondo any help or technics I should use would be greatly appreciated. Thanks

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I was wondering if I can use bondo on the bottom of my case to flush it out? It is a nes case with a lexan motherboard tray epoxied on, scuffed up with 60 grit sandpaper.I am worried about cracking if I use bondo any help or technics I should use would be greatly appreciated. Thanks

-PIC-

 

I'm no expert but I would assume something that large of a gap should have something like fiber glass reinforced bondo or something that will help strength the bond itself cause bondo itself doens't take flex too well and will crack.

 

 

Here's just an idea but MNPC tech used this filler to level out a flange for a fan opening: (13:30)

 

Edited by W-L
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Thanks for the help.I decided to use fiberglass filler instead. Seams to be working good so far.you can check out my build log here.http://linustechtips.com/main/topic/234249-nes-build-1985-2015-30th-anniversary/

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