My Themral Paste Has a wierd method?

[FLAMMABLEGAS17481]

so i got thermal paste as mine didnt come with it.

i got deep cool Z3

and it says use the bussiness card method? WHY????

[SirRoderick]

Look, it really doesn't matter as long as you get an even-ish spread. Do whatever you like

[Firearm2112]

I'm sure you can use whatever method you want

[DigitalHermit]

I use that... It's better than stock...

 

Also, it's thermal paste... Do whatever you want... I prefer the pea method...

[ShadowCaptain]

so i got thermal paste as mine didnt come with it.

i got deep cool Z3

and it says use the bussiness card method? WHY????

 

Some thermal pastes are very viscous and do not spread well using the pea method so they suggest spreading it manually 

 

where as less viscous pastes spread easily so do not need to be manually spread

 

That is my understanding anyway

[Samfisher]

With the amount of force a heatsink attaches to the motherboard, pea method should work with both high and low viscosity pastes.

[TheProfosist]

With the amount of force a heatsink attaches to the motherboard, pea method should work with both high and low viscosity pastes.

Correct and card method has shown to be worse and prompt more remounts to to air pockets or actually too much paste.

[Giraffackle]

From what I know, the business card method is applying thermal paste, then spreading it with a card. Honestly, this isn't really necessary as whatever cooler you are using will spread it out itself with you place it on. Do whatever method you prefer and you will be fine 

[Jey R.]

Yes, it's true. Just use pea method. Let the heatsink apply and spread the thermal across the IHC.

[AHaskin14]

of course just dont put on too much because then it gets all over around your socket and that stuff can be a pain to clean off.

[harrynowl]

For LGA115x I use the pea method, for AM3+/2011 I use the line.

[zuboici]

Look, it really doesn't matter as long as you get an even-ish spread. Do whatever you like

 

 Except an even-ish spread invites bubbles no? Pea method. Actually rice but whatever. Lentil?

[Veil]

Compression between your chip and cooler should be the only thing spreading your material.

The business card method has been proven to introduce air bubbles, which just trap heat, instead of allowing heat to transfer from your chip to your heatsink.

[LukaP]

Some thermal pastes are very viscous and do not spread well using the pea method so they suggest spreading it manually 

 

where as less viscous pastes spread easily so do not need to be manually spread

 

That is my understanding anyway

the pressures involved with this process are so large that viscosity barely plays a role. plus with heat viscosity goes down, paste spreads more