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Pump-out Effect

coalminer071
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if someone can explain this term to me, I would be grateful. 

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could you elaborate?

It's something about thermal paste, probably people overcomplicating something very simple with drivel but I don't know exactly what.

But yeah some context would be nice...

what am I missing here

this must have something to do with water cooling, and google has literally only this thread as a relevant result.

Error: 410

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It's something about thermal paste, probably people overcomplicating something very simple with drivel but I don't know exactly what.

 

But yeah some context would be nice...

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sorry yes, Its regarding TIM, might delid a 3770K, read somewhere that some tim have pump-out effect. But they didnt explain what it means.

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this must have something to do with water cooling, and google has literally only this thread as a relevant result.

 

I guess, and this is only a guess, that it involves thermal compound working its way out bit by bit as it expands due to heat each thermal/power cycle.

 

IDK I don't care, OP I suggest you just ignore it, if it was something important or overly relevant it would have been covered and be a well known term.

 

EDIT I think I nailed it, here.

http://www.electronics-cooling.com/2007/11/reliability-testing-of-thermal-greases/

 

The two main causes of increase in thermal resistance of a grease layer are grease pump-out and grease dry-out. The powering up or powering down of the device causes a relative motion between the die and the heat spreader (in-plane and out-of-plane), which tends to squeeze the thermal grease out of the interface gap. This phenomenon is referred to as “pump-out” and results in increased thermal resistance due to loss of grease material from the interface [1, 3].

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sorry yes, Its regarding TIM, might delid a 3770K, read somewhere that some tim have pump-out effect. But they didnt explain what it means.

it's like what Askew said

depending on the viscosity of the paste, it will vary with how long it takes for the thermal paste to completely spread and give optimal contact. Every heat cycle the paste should expand out more to get better coverage, up to a certain point.

The effect is very small, though. Best/extreme scenarios, the difference is probably <2c

Error: 410

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it's like what Askew said

depending on the viscosity of the paste, it will vary with how long it takes for the thermal paste to completely spread and give optimal contact. Every heat cycle the paste should expand out more to get better coverage, up to a certain point.

The effect is very small, though. Best/extreme scenarios, the difference is probably <2c

 

No, from what I fathom here this is about the paste working its way past the point of optimal contact to the detriment of the interface, and this is due to power cycling over time.

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cause due to this chart

http://forums.anandtech.com/showpost.php?p=34297433&postcount=67

they were saying that NT-H1 from noctua has very good performance but have no longevity due to pump-out effect.

i think i should use the liquid ultra.

CPU i7 3770K@4.6Ghz Motherboard  Asus Maximus V Extreme Ram 4x4GB Corsair Dominator Platinum @ 1866Mhz GPU 3-Way Sli EVGA Gtx 780 //Core@1.2Ghz/Mem@7Ghz// PSU Corsair Ax1200i Storage OS 2xSamsung 840 Pro 128GB // 2xOCZ Vertex 4 128GB // 2xWD Red 4TB Keyboard Corsair K70 Mouse Steelseries Xai Cooling Custom Dual Loop Case Corsair 900D
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cause due to this chart

http://forums.anandtech.com/showpost.php?p=34297433&postcount=67

they were saying that NT-H1 from noctua has very good performance but have no longevity due to pump-out effect.

i think i should use the liquid ultra.

 

Now I think I understand why this isn't covered widely, it's a study on how TIM designed to interface with a metal IHS behaves when used on bare silicon.

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well i do need some tim when i delid 3770k thats why i searched for this thread

CPU i7 3770K@4.6Ghz Motherboard  Asus Maximus V Extreme Ram 4x4GB Corsair Dominator Platinum @ 1866Mhz GPU 3-Way Sli EVGA Gtx 780 //Core@1.2Ghz/Mem@7Ghz// PSU Corsair Ax1200i Storage OS 2xSamsung 840 Pro 128GB // 2xOCZ Vertex 4 128GB // 2xWD Red 4TB Keyboard Corsair K70 Mouse Steelseries Xai Cooling Custom Dual Loop Case Corsair 900D
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reasoning is the viscosity of the NT-H1 at low/mid is very thin and can spread/cure

quickly. the CL Pro/Ultra is further up the temperature scan to prevent the "pump-out'.

only issue is that the silicon die to IHS has no curvature (flat-to-flat). for temp usage

i used NT-H1 and MX4, until the CL Ultra got in. deffo degree drops on delids.

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reasoning is the viscosity of the NT-H1 at low/mid is very thin and can spread/cure

quickly. the CL Pro/Ultra is further up the temperature scan to prevent the "pump-out'.

only issue is that the silicon die to IHS has no curvature (flat-to-flat). for temp usage

i used NT-H1 and MX4, until the CL Ultra got in. deffo degree drops on delids.

so u would definitely use clu on die and mx4 or arctic silver 5 on IHS?

CPU i7 3770K@4.6Ghz Motherboard  Asus Maximus V Extreme Ram 4x4GB Corsair Dominator Platinum @ 1866Mhz GPU 3-Way Sli EVGA Gtx 780 //Core@1.2Ghz/Mem@7Ghz// PSU Corsair Ax1200i Storage OS 2xSamsung 840 Pro 128GB // 2xOCZ Vertex 4 128GB // 2xWD Red 4TB Keyboard Corsair K70 Mouse Steelseries Xai Cooling Custom Dual Loop Case Corsair 900D
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what about Tuniq TX-4 saw some good reviews on them.

CPU i7 3770K@4.6Ghz Motherboard  Asus Maximus V Extreme Ram 4x4GB Corsair Dominator Platinum @ 1866Mhz GPU 3-Way Sli EVGA Gtx 780 //Core@1.2Ghz/Mem@7Ghz// PSU Corsair Ax1200i Storage OS 2xSamsung 840 Pro 128GB // 2xOCZ Vertex 4 128GB // 2xWD Red 4TB Keyboard Corsair K70 Mouse Steelseries Xai Cooling Custom Dual Loop Case Corsair 900D
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